Display device

ABSTRACT

A display device includes a substrate including a first substrate portion including a first area, a second substrate portion including a second area, and a bending area between the first substrate portion and the second substrate portion, the substrate being bendable around a bending axis that extends in a first direction, an encapsulation portion over the first substrate portion, a seal portion between the first substrate portion and the encapsulation portion to bond the first substrate portion to the encapsulation portion, an intermediate wiring including a first intermediate wiring portion in the first area and a second intermediate wiring portion in the second area, the intermediate wiring being covered by at least one inorganic layer, and a connection wiring including at least a portion in the bending area and connecting the first intermediate wiring portion to the second intermediate wiring portion.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2018-0111602, filed on Sep. 18, 2018,in the Korean Intellectual Property Office, and entitled: “DisplayDevice,” is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

One or more embodiments relate to a display device.

2. Description of the Related Art

Generally, display devices may be used in electronic apparatuses such assmartphones, laptop computers, digital cameras, camcorders, personaldigital assistants, notebook computers, table personal computers, orelectronic apparatuses such as desktop computers, televisions, outdoorbillboards, display devices for exhibition, instrument panels forautomobiles, head up displays (HUDs).

SUMMARY

Embodiments are directed to a display device including a substrateincluding a first substrate portion including a first area, a secondsubstrate portion including a second area, and a bending area betweenthe first substrate portion and the second substrate portion, thesubstrate being bendable around a bending axis that extends in a firstdirection at the bending area, an encapsulation portion over the firstsubstrate portion, a seal portion between the first substrate portionand the encapsulation portion to bond the first substrate portion to theencapsulation portion, an intermediate wiring including a firstintermediate wiring portion in the first area and a second intermediatewiring portion in the second area, the intermediate wiring being coveredby at least one inorganic layer, and a connection wiring including atleast a portion in the bending area and connecting the firstintermediate wiring portion to the second intermediate wiring portion.

The second substrate portion may be separately located below the firstsubstrate portion in a vertical direction of the substrate. The firstsubstrate portion may be connected to the second substrate portion bythe bending area.

The bending area may be in an interval between the first substrateportion and the second substrate portion. A bending material may fillthe interval.

The bending material may include an organic material.

A height of the bending material may correspond to a sum of a firstthickness of the at least one inorganic layer and a second thickness ofthe intermediate wiring in the vertical direction of the substrate.

A support material may support the substrate. The support material maybe in a portion of the interval between the first substrate portion andthe second substrate portion below the bending material.

The connection wiring may extend across the first area, the bendingarea, and the second area. The connection wiring may be bendable in thebending area.

The connection wiring may be connected to the first intermediate wiringportion and the second intermediate wiring portion by respective contactportions inside contact holes in the at least one inorganic layer.

The connection wiring may be exposed over the substrate. An upperorganic layer covering the connection wiring may be on the connectionwiring.

The connection wiring may be surrounded by the bending material and theupper organic layer in the bending area.

The seal portion may be spaced apart from the upper organic layer. Aspace may be between the seal portion and the upper organic layer.

The seal portion may at least partially overlap the first intermediatewiring portion in a vertical direction of the substrate.

A pad terminal electrically connected to the connection wiring may be inthe second substrate portion. A driving terminal of a driver may beconnected to the pad terminal.

A display area may be in the first area. The intermediate wiring may beelectrically connected to a device inside the display area.

Embodiments are directed to a display device including a substrateincluding a first substrate portion including a display area, a secondsubstrate portion including a pad terminal, and a bending areaconnecting the first substrate portion to the second substrate portion,an encapsulation portion over the first substrate portion, a sealportion between the first substrate portion and the encapsulationportion to bond the first substrate portion to the encapsulationportion, an intermediate wiring including a first intermediate wiringportion electrically connected to a device inside the display area, anda second intermediate wiring portion electrically connected to the padterminal and covered by at least one inorganic layer, and a connectionwiring over the substrate, the connection wiring connecting the firstintermediate wiring portion to the second intermediate wiring portion.The bending area may be in an interval between the first substrateportion and the second substrate portion. The bending area may be filledwith a bending material including an organic material.

A height of the bending material may correspond to a sum of a firstthickness of the at least one inorganic layer and a second thickness ofthe intermediate wiring in a vertical direction of the substrate.

A support material that supports the substrate may be in a portion ofthe interval between the first substrate portion and the secondsubstrate portion below the bending material.

The connection wiring may extend across the first substrate portion, thebending area, and the second substrate portion. The connection wiringmay be bendable in the bending area.

The connection wiring may be connected to the first intermediate wiringportion and to the second intermediate wiring portion respectively bycontact portions inside contact holes arranged in the at least oneinorganic layer.

The connection wiring may be exposed over the substrate. An upperorganic layer covering the connection wiring may be on the connectionwiring. The connection wiring may be surrounded by the bending materialand the upper organic layer in the bending area.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 illustrates a separated perspective view of a display deviceaccording to an embodiment;

FIG. 2 illustrates an enlarged cross-sectional view of the displaydevice of FIG. 1;

FIG. 3 illustrates an enlarged cross-sectional view of a state in whicha portion of the display device of FIG. 2 is unfolded; and

FIG. 4 illustrates an enlarged cross-sectional view of a state in whicha portion of the display device of FIG. 3 is bent.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. Further, it will be understoodthat when a layer is referred to as being “under” another layer, it canbe directly under, and one or more intervening layers may also bepresent. In addition, it will also be understood that when a layer isreferred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent. Like reference numerals refer to like elements throughout.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

FIG. 1 illustrates a separated perspective view of a display device 100according to an embodiment.

Referring to FIG. 1, the display device 100 may include a display panel200. In an embodiment, the display device 100 may be an organiclight-emitting display device. In some implementations, the displaydevice 100 may be a liquid crystal display, a field emission display, oran electronic paper display device.

The display panel 200 may include a substrate 201 and an encapsulationportion 202 arranged over the substrate 201. A seal portion 203 may bearranged between the substrate 201 and the encapsulation portion 202.The seal portion 203 may be arranged on a surface faced by the substrate201 and the encapsulation portion 202. The seal portion 203 may bearranged along an edge of the substrate 201 and the encapsulationportion 202.

One of the substrate 201 and the encapsulation portion 202 may beexposed by extending to the outside of the other. For example, one area204 of the substrate 201 may be exposed to the outside of an area wherethe substrate 201 overlaps the encapsulation portion 202 in a seconddirection (Y-direction) of the display panel 200. The exposed area 204includes a non-display area NDA. In an embodiment, the one area 204 ofthe substrate 201 may not be exposed and one area of the encapsulationportion 202 may be exposed.

A pad area PA, in which a plurality of pad terminals 205 are patterned,and a fan-out area FA, in which a plurality of wirings 206 are patternedmay be arranged in the non-display area NDA.

The pad terminal 205 may be electrically connected to the wiring 206 andmay be also electrically connected to a driving terminal 151 of a driver150 such as a chip-on-film (COF). The wiring 206 may be electricallyconnected to devices inside a display area DA that displays an image.

A touch sensing unit 120 may be arranged over the encapsulation portion202. The touch sensing unit 120 may be an on-cell touch sensing unitarranged on the encapsulation portion 202. The on-cell touch sensingunit may include a touch screen pattern. The touch sensing unit 120 maybe, for example, formed as one body with the encapsulation portion 202.

A polarization layer 130 may be arranged over the touch sensing unit120. The polarization layer 130 may block external light reflection.

A window cover 140 configured to protect the display panel 200, thetouch sensing unit 120, and the polarization layer 130 may be arrangedover the polarization layer 130. The window cover 140 may include rigidglass or a flexible film.

In an embodiment, a bending area BA that bends the substrate 201 in onedirection may be arranged in the display panel 200.

FIG. 2 illustrates an enlarged cross-sectional view of a portion of thedisplay device 100 of FIG. 1. FIG. 3 illustrates an enlargedcross-sectional view of a state in which a portion of the display device100 of FIG. 2 is unfolded. FIG. 4 is an enlarged cross-sectional view ofa state in which a portion of the display device 100 of FIG. 3 is bent.

Referring to FIGS. 2 to 4, the display panel 200 may include thesubstrate 201. The substrate 201 may include a first substrate portion207 in which a first area 1A is arranged, a second substrate portion 208in which a second area 2A is arranged, and the bending area BA betweenthe first area 207 and the second area 208. The bending area BA mayextend in a first direction (X-direction) of the substrate 201. Thebending area BA may be located between the first area 1A and the secondarea 2A in the second direction (Y-direction) that crosses the firstdirection (X-direction). The substrate 201 may be bent around a virtualbending axis extending in the first direction (X-direction).

The substrate 201 including the first substrate portion 207 and thesecond substrate portion 208 may include a rigid substrate. The firstsubstrate portion 207 and the second substrate portion 208 may besubstrates including the same material. In an embodiment, the firstsubstrate portion 207 and the second substrate portion 208 may be glasssubstrates. In some implementations, the first substrate portion 207 andthe second substrate portion 208 may be a polymer substrate, a metalsubstrate, or a composite substrate thereof.

The first area 1A includes the display area DA. In an embodiment, thefirst area 1A may further include a portion of the non-display area NDAin addition to the display area DA.

A thin film transistor TFT may be arranged in the display area DA andmay be electrically connected to an organic light-emitting diode 220,which is a display element. Electric connection of the organiclight-emitting diode 220 to the thin film transistor TFT may includeelectrical connection of a pixel electrode 221 of the organiclight-emitting diode 220 to the thin film transistor TFT.

A thin film transistor TFT may be further arranged in a peripheral areaoutside the display area DA. The thin film transistor TFT arranged inthe peripheral area may be a portion of a circuit unit configured tocontrol an electric signal applied to the display area DA.

The thin film transistor TFT may include a semiconductor layer 210, agate electrode 215, a source electrode 217, and a drain electrode 218.The semiconductor layer 210 may include amorphous silicon,polycrystalline silicon, or an organic semiconductor material.

A first inorganic layer 209 may be arranged on the substrate 201. Thefirst inorganic layer 209 may be a barrier layer. The first inorganiclayer 209 may include an inorganic material such as silicon oxide,silicon nitride, and/or silicon oxynitride. The first inorganic layer209 may planarize a surface of the substrate 201 and reduce or preventthe penetration of moisture or external air. The first inorganic layer209 may be in a form of a single layer or a multi-layer.

The semiconductor layer 210 may be arranged on the first inorganic layer209. The semiconductor layer 210 may include a channel region 211, asource region 212, and a drain region 213. The source region 212 and thedrain region 213 may be arranged on two opposite sides of the channelregion 211 and may be doped with impurities.

The semiconductor layer 210 may be covered by a second inorganic layer214. The second inorganic layer 214 may include a gate insulating layer.The second inorganic layer 214 may include an inorganic material such assilicon oxide, silicon nitride, and/or silicon oxynitride. The secondinorganic layer 214 may be in a form of a single layer or a multi-layer.

The gate electrode 215 may be arranged on the second inorganic layer214. The gate electrode 215 may include a metal material havingconductivity. For example, the gate electrode 215 may include one of Mo,Al, Cu, and Ti. The gate electrode 215 may be in a form of a singlelayer or a multi-layer.

The gate electrode 215 may be covered by a third inorganic layer 216.The third inorganic layer 216 may be an interlayer insulating layer. Thethird inorganic layer 216 may include an inorganic material such assilicon oxide, silicon nitride, and/or silicon oxynitride. The thirdinorganic layer 216 may be in a form of a single layer or a multi-layer.

The source electrode 217 and the drain electrode 218 may be arranged onthe third inorganic layer 216. The source electrode 217 and the drainelectrode 218 may include a metal material having conductivity. Forexample, the source electrode 217 and the drain electrode 218 mayinclude one of Mo, Al, Cu, and Ti. The source electrode 217 and thedrain electrode 218 may be in a form of a single layer or a multi-layer.For example, each of the source electrode 217 and the drain electrode218 may have a stacked structure of Ti/Al/Ti.

The first inorganic layer 209, the second inorganic layer 214, and thethird inorganic layer 216 may be deposited by a deposition process. Thefirst inorganic layer 209, the second inorganic layer 214, and the thirdinorganic layer 216 may extend over the first substrate portion 207 andthe second substrate portion 208.

A planarization layer 219 may be arranged on the thin film transistorTFT. For example, in the case where the organic light-emitting diode 220is arranged over the thin film transistor TFT, the planarization layer219 may planarize a portion located on the thin film transistor TFT. Theplanarization layer 219 may include an organic material. For example,the planarization layer 219 may include acrylic, benzocyclobutene (BCB),or hexamethyldisiloxane (HMDSO).

A pixel-defining layer 224 may be arranged on the planarization layer219. The pixel-defining layer 224 may include an opening correspondingto each sub-pixel and may define each sub-pixel by the opening. Forexample, the pixel-defining layer 224 may include an opening thatexposes a portion of a surface of the pixel electrode 221. Thepixel-defining layer 224 may include an organic material such aspolyimide or HMDSO.

The planarization layer 219 and the pixel-defining layer 224 may have asingle-layer stacking structure of an organic material layer. In someimplementations, the planarization layer 219 may have a two-layerstructure or another organic material layer may be further arrangedbetween the planarization layer 219 and the pixel-defining layer 224.

The organic light-emitting diode 220 may be arranged on theplanarization layer 219. The organic light-emitting diode 220 mayinclude the pixel electrode 221, an opposite electrode 223, and anintermediate layer 222 arranged between the pixel electrode 221 and theopposite electrode 223. The intermediate layer 222 may include anemissive layer.

The pixel electrode 221 may contact one of the source electrode 217 andthe drain electrode 218 through a contact hole provided in theplanarization layer 219. The pixel electrode 221 may include atransparent electrode or a reflective electrode. In the case where thepixel electrode 221 includes a transparent electrode, the pixelelectrode 221 includes a transparent conductive layer. In the case wherethe pixel electrode 221 includes a reflective electrode, the pixelelectrode 221 includes a reflective layer and a transparent conductivelayer on the reflective layer.

The intermediate layer 222 may include an organic emissive layer.

In another embodiment, the intermediate layer 222 may include an organicemissive layer and may further include at least one of a hole injectionlayer (HIL), a hole transport layer (HTL), an electron transport layer(ETL), and an electron injection layer (EIL).

In an embodiment, the intermediate layer 222 may include an organicemissive layer and may additionally further include various functionallayers depending on a use purpose of the display device 100.

The intermediate layer 222 may have a suitable structure. For example,the intermediate layer 222 may include a layer that is one body over aplurality of pixel electrodes 221 or may include a layer patterned tocorrespond to each of the plurality of pixel electrodes 221.

The opposite electrode 223 may cover the display area DA. The oppositeelectrode 223 may extend as one body over a plurality of organiclight-emitting diodes 220 and correspond to the plurality of pixelelectrodes 221. The opposite electrode 223 may be a common electrode.The opposite electrode 223 may be a transparent electrode or areflective electrode. When the opposite electrode 223 is a transparentelectrode, the opposite electrode 223 may include a metal layer and atransparent conductive layer arranged on the metal layer. When theopposite electrode 223 is a reflective electrode, the opposite electrode223 may include a metal layer.

In an embodiment, a plurality of sub-pixels may be arranged over thefirst substrate portion 207. Each sub-pixel may implement red, green,blue or white color, as examples.

The second area 2A includes the non-display area NDA. In an embodiment,the second area 2A may further include the display area DA.

The plurality of inorganic layers, for example, the first inorganiclayer 209, the second inorganic layer 214, and the third inorganic layer216, may be stacked on the second substrate portion 208. Like the firstsubstrate portion 207, the first inorganic layer 209, the secondinorganic layer 214, and the third inorganic layer 216 may be stacked onthe second substrate portion 208.

In some implementations, another inorganic layer may be further arrangedover the second substrate portion 208, or some inorganic layers may beomitted. For example, besides the first inorganic layer 209, the secondinorganic layer 214, and the third inorganic layer 216, anotherinorganic layer may be independently arranged over the second substrateportion 208.

The encapsulation portion 202 may be coupled over the substrate 201. Theencapsulation portion 202 may protect the organic light-emitting diode202 and other devices from moisture or external air. In an embodiment,the encapsulation portion 202 may be a rigid glass substrate. In anembodiment, the encapsulation portion 202 may include a polymersubstrate, a metal substrate, or a composite substrate thereof.

The seal portion 203 may be arranged between the substrate 201 and theencapsulation portion 202. The seal portion 203 may be arranged onsurfaces of the first substrate portion 207 and the encapsulationportion 202 that face each other. The seal portion 203 may surround thedisplay area DA over the first substrate portion 207. The seal portion203 may include frit glass. The frit glass may include glass powder andan oxide powder. The seal portion 203 may bond the first substrateportion 207 onto the encapsulation portion 202.

The first substrate portion 207 may be spaced apart from the secondsubstrate portion 208 so as to reduce a dead space, which is an areathat is not directly involved in emitting light, for example, an areaother than the display area DA. The first substrate portion 207 and thesecond substrate portion 208 that are spaced apart from each other maybe connected by the bending area BA. The first substrate portion 207 andthe second substrate portion 208 may be located vertically with respectto each other.

An intermediate wiring 225 may be arranged over the substrate 201. Theintermediate wiring 225 may be electrically connected to a device insidethe display area DA. The intermediate wiring 225 may include a firstintermediate wiring portion 226 and a second intermediate wiring portion227. In some implementations, the intermediate wiring 225 may include aplurality of spaced apart intermediate wiring portions.

The first intermediate wiring portion 226 may be arranged in the firstarea 1A. A first end 226 a of the first intermediate wiring portion 226may extend to one edge 207 a of the first substrate portion 207. Asecond end 226 b of the first intermediate wiring portion 226 mayoverlap the seal portion 203 in the vertical direction (Z-direction) ofthe substrate 201.

The second intermediate wiring portion 227 may be arranged in the secondarea 2A. An end 227 a of the second intermediate wiring portion 227 mayextend to one edge 208 a of the second substrate portion 208. The oneedge 207 a of the first substrate portion 207 may face the one edge 208a of the second substrate portion 208.

The first intermediate wiring portion 226 and the second intermediatewiring portion 227 may be arranged on the same layer as the gateelectrode 215. The first intermediate wiring portion 226 and the secondintermediate wiring portion 227 may be formed by using the same materialas the gate electrode 215 during a same process of forming the gateelectrode 215. The first intermediate wiring portion 226 and the secondintermediate wiring portion 227 may be covered by the third inorganiclayer 216.

In an embodiment, the first intermediate wiring portion 226 and thesecond intermediate wiring portion 227 may be covered by an inorganiclayer that is independently arranged over the second substrate portion208. In some implementations, a plurality of inorganic layers may bestacked on the first intermediate wiring portion 226 and the secondintermediate wiring portion 227.

The connection wiring 233 may be arranged over the intermediate wiring225. The connection wiring 233 may connect the first intermediate wiringportion 226 to the second intermediate wiring portion 227. At least aportion of the connection wiring 233 may be arranged in the bending areaBA.

The connection wiring 233 may extend across the first area 1A, thebending area BA and the second area 2A. The connection wiring 233 may bebent in the bending area BA. The connection wiring 233 may include thesame material as the source electrode 217 and the drain electrode 218during a same process of forming the source electrode 217 and the drainelectrode 218. The connection wiring 233 may include one of Mo, Al, Cu,and Ti. In an embodiment, the connection wiring 233 may have a stackedstructure of Ti/Al/Ti. The connection wiring 233 may be electricallyconnected to the wiring 206 arranged in the fan-out area FA and the padterminal 205 arranged in the pad area PA. The pad terminal 205 may beconnected to the driving terminal 151 of the driver 150.

The connection wiring 233 may be electrically connected to the firstintermediate wiring portion 226 by a first contact portion 234 filling afirst contact hole 1CTH that passes through the third inorganic layer216. The connection wiring 233 may be electrically connected to thesecond intermediate wiring portion 227 by a second contact portion 235filling a second contact hole 2CTH that passes through the thirdinorganic layer 216.

As described above, the first intermediate wiring portion 226 arrangedover the first substrate portion 207 may be electrically connected tothe second intermediate wiring portion 227 arranged over the secondsubstrate portion 208 by the connection wiring 233.

As described above, the first substrate portion 207 may be spaced apartfrom the second substrate portion 208. The second substrate portion 208may be arranged below the first substrate portion 207 in the verticaldirection of the substrate 201. The first substrate portion 207 may beconnected to the second substrate portion 208 by the bending area BA.The bending area BA may be arranged in an interval d between the firstsubstrate portion 207 and the second substrate portion 208. The intervald may correspond to a space between the one edge 207 a of the firstsubstrate portion 207 and the one edge 208 a of the second substrateportion 208. The interval d may extend in the first direction(X-direction of the substrate 201).

A bending material 231 may be arranged in the interval d.

The bending material 231 may include an organic material. For example,the bending material 231 may include one of acrylic, BCB, HMDSO, andpolyimide.

With regard to the bending material 231, an organic material preparedseparately from the planarization layer 219 in the first area 1A may bearranged in the interval d. In an embodiment, the bending material 231may be formed using the same material as that of the planarization layer219 during the same process of forming the planarization layer 219. Whenthe bending material 231 is an organic material that can be arranged inthe interval d between the first substrate portion 207 and the secondsubstrate portion 208, the organic material may be simultaneously formedwith one of the organic materials provided to the display panel 200, ormay be formed through a separate process.

A height h of the bending material 231 may correspond to a sum of afirst thickness t1 of the plurality of inorganic layers including thefirst inorganic layer 209, the second inorganic layer 214, and the thirdinorganic layer 216 arranged on the substrate 201, and a secondthickness t2 of the intermediate wiring 225. The first thickness t1 ofthe plurality of inorganic layers, for example, the first inorganiclayer 209, the second inorganic layer 214, and the third inorganic layer216, may be a total thickness of the first inorganic layer 209, thesecond inorganic layer 214, and the third inorganic layer 216 that arestacked. The second thickness t2 of the intermediate wiring 225 may be athickness of one of the first intermediate wiring portion 226 and thesecond intermediate wiring portion 227.

A support material 232 configured to support the substrate 201 may befurther arranged in a portion of the interval d between the firstsubstrate portion 207 and the second substrate portion 208 under thebending material 231. The support material 232 may be a material thathas flexibility to support the substrate 201as the substrate 201 isbent.

The connection wiring 233 may be exposed on the first substrate portion207 and the second substrate portion 208. To prevent oxidation of theconnection wiring 233, an upper organic layer 236 may be arranged on theconnection wiring 233.

The upper organic layer 236 may be made of a suitable material. Forexample, the upper organic layer 236 may be formed by using the samematerial as that of the planarization layer 219 during the same processas a process of foiling the planarization layer 219. When the upperorganic layer 236 is an organic material covering the connection wiring233, the upper organic layer 236 may be simultaneously formed with oneof the organic materials provided to the display panel 200, or may beformed through a separate process.

In the bending area BA, the connection wiring 233 may be surrounded bythe bending material 231 and the upper organic layer 236. For example, afirst surface 233a of the connection wiring 233 may be covered by thebending material 231, and a second surface 233b of the connection wiring233 may be covered by the upper organic layer 236. The first surface233a and the second surface 233b of the connection wiring 233 may be twoopposite surfaces.

The seal portion 203 may be spaced apart from the upper organic layer236. For example, a space S may be formed between the seal portion 203and the upper organic layer 236. Due to the space S, the upper organiclayer 236 may be spaced apart from the seal portion 203. The space S maybe formed so as to help prevent damage to the upper organic layer 236including the organic material, which may be relatively vulnerable toheat while laser energy is irradiated onto the seal portion 203 forbonding of the first substrate portion 207 and the encapsulation portion202.

The seal portion 203 and the first intermediate wiring portion 226 mayinclude an overlapping area OL in which the seal portion 203 at leastpartially overlaps the first intermediate wiring portion 226 in thevertical direction (Z-direction) of the substrate 201. The overlappingarea OL may be formed so as to help prevent damage to the firstsubstrate portion 207 during a laser irradiation process. The firstintermediate wiring portion 226 may block a laser beam from beingirradiated onto the first substrate portion 207.

A process of manufacturing the display panel 200 having the aboveconfiguration is briefly described below.

The substrate 201 may be prepared. The substrate 201 may have astructure in which the first substrate portion 207, the second substrateportion 208, and the bending area BA are connected as one body. Thesubstrate 201 at an initial stage may be a single glass substrate inwhich the first substrate portion 207 is not separated from the secondsubstrate portion 208. The same glass material as that of the firstsubstrate portion 207 and the second substrate portion 208 may bearranged in the bending area BA so as to connect the first substrateportion 207 to the second substrate portion 208. In an embodiment, thefirst substrate portion 207, the second substrate portion 208, and thebending area BA may constitute one body.

The first inorganic layer 209, the second inorganic layer 214, and thethird inorganic layer 216 are formed on the first substrate portion 207,the second substrate portion 208, and the bending area BA. The firstintermediate wiring portion 226 may be patterned over the firstsubstrate portion 207, and the second intermediate wiring portion 227may be patterned over the second substrate portion 208. The firstintermediate wiring portion 226 and the second intermediate wiringportion 227 may be formed on the second inorganic layer 214.

Through an etching process, the first contact hole 1CTH may be formed inthe first area 1A, and the second contact hole 1CTH may be formed in thesecond area 2A. The first contact hole 1CTH and the second contact hole2CTH may be formed by removing a portion of the third inorganic layer216.

The connection wiring 233 may be formed over the intermediate wiring225. The connection wiring 233 may extend across the first area 1A, thebending area BA, and the second area 2A. The connection wiring 233 maybe electrically connected to the first intermediate wiring portion 226by the first contact portion 234 filling the first contact hole 1CTH.The connection wiring 233 may be electrically connected to the secondintermediate wiring portion 227 by the second contact portion 235filling the second contact hole 2CTH.

While the first contact hole 1CTH and the second contact hole 2CTH areformed, the interval d may be formed in the bending area BA by the sameetching process. The interval d may include an area that passes throughthe first inorganic layer 209, the second inorganic layer 214, and thethird inorganic layer 216.

The bending material 231 including the organic material may fill theinterval d.

The support material 232 may be provided under the bending material 231.For example, an area under the bending material 231 may be etched from abottom surface 201a of the substrate 201 by a predetermined depth in thevertical direction (Z-direction) of the substrate 201. The supportmaterial 232 may fill the etched area.

Through the above process, the first substrate portion 207 may beseparated from the second substrate portion 208. The bending material231 and the support material 232 may fill the interval d between thefirst substrate portion 207 and the second substrate portion 208. Whenthe bending area BA is bent in one direction, as shown in FIG. 4, thesecond substrate portion 208 may be located below the first substrateportion 207 in the vertical direction (Z-direction) of the substrate201.

By way of summation and review, a display unit may be arranged over asubstrate of a display device. A wiring may be arranged in one area ofthe substrate, and a driver may be connected to a pad terminal. Inaddition to an area in which a display unit configured to display animage is arranged, the display device may also include a dead space,which is an area that is not directly involved in emitting light. Thedead space may include an area in which a wiring such as a fan-out unitis arranged and an area in which a driver such as a chip-on-film (COF)is connected to the pad terminal.

To implement a full screen display, it is desirable that a displaydevice reduce an area of a dead space. One or more embodiments include adisplay device that minimizes a dead space. For example, in the displaydevice according to an embodiments, a plurality of substrate portionsmay be bent and relocated vertically. As a result, a dead space may beminimized.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope thereof the presentinvention as set forth in the following claims.

What is claimed is:
 1. A display device, comprising: a substrateincluding a first substrate portion including a first area, a secondsubstrate portion including a second area, and a bending area betweenthe first substrate portion and the second substrate portion, thesubstrate being bendable around a bending axis that extends in a firstdirection at the bending area; an encapsulation portion over the firstsubstrate portion; a seal portion between the first substrate portionand the encapsulation portion to bond the first substrate portion to theencapsulation portion; an intermediate wiring including a firstintermediate wiring portion in the first area and a second intermediatewiring portion in the second area, the intermediate wiring being coveredby at least one inorganic layer; and a connection wiring including atleast a portion in the bending area and connecting the firstintermediate wiring portion to the second intermediate wiring portion.2. The display device as claimed in claim 1, wherein: the secondsubstrate portion is separately located below the first substrateportion in a vertical direction of the substrate, and the firstsubstrate portion is connected to the second substrate portion by thebending area.
 3. The display device as claimed in claim 2, wherein: thebending area is in an interval between the first substrate portion andthe second substrate portion, and a bending material fills the interval.4. The display device as claimed in claim 3, wherein the bendingmaterial includes an organic material.
 5. The display device as claimedin claim 3, wherein a height of the bending material corresponds to asum of a first thickness of the at least one inorganic layer and asecond thickness of the intermediate wiring in the vertical direction ofthe substrate.
 6. The display device as claimed in claim 5, wherein asupport material supports the substrate and is in a portion of theinterval between the first substrate portion and the second substrateportion below the bending material.
 7. The display device as claimed inclaim 3, wherein the connection wiring extends across the first area,the bending area, and the second area, and is bendable in the bendingarea.
 8. The display device as claimed in claim 7, wherein theconnection wiring is connected to the first intermediate wiring portionand the second intermediate wiring portion by respective contactportions inside contact holes in the at least one inorganic layer. 9.The display device as claimed in claim 3, wherein: the connection wiringis exposed over the substrate, and an upper organic layer covering theconnection wiring is on the connection wiring.
 10. The display device asclaimed in claim 9, wherein the connection wiring is surrounded by thebending material and the upper organic layer in the bending area. 11.The display device as claimed in claim 9, wherein: the seal portion isspaced apart from the upper organic layer, and a space is between theseal portion and the upper organic layer.
 12. The display device asclaimed in claim 1, wherein the seal portion at least partially overlapsthe first intermediate wiring portion in a vertical direction of thesubstrate.
 13. The display device as claimed in claim 1, wherein: a padterminal electrically connected to the connection wiring is in thesecond substrate portion, and a driving terminal of a driver isconnected to the pad terminal.
 14. The display device as claimed inclaim 1, wherein: a display area is in the first area, and theintermediate wiring is electrically connected to a device inside thedisplay area.
 15. A display device, comprising: a substrate including afirst substrate portion including a display area, a second substrateportion including a pad terminal, and a bending area connecting thefirst substrate portion to the second substrate portion; anencapsulation portion over the first substrate portion; a seal portionbetween the first substrate portion and the encapsulation portion tobond the first substrate portion to the encapsulation portion; anintermediate wiring including a first intermediate wiring portionelectrically connected to a device inside the display area, and a secondintermediate wiring portion electrically connected to the pad terminaland covered by at least one inorganic layer; and a connection wiringover the substrate, the connection wiring connecting the firstintermediate wiring portion to the second intermediate wiring portion,wherein the bending area is in an interval between the first substrateportion and the second substrate portion and is filled with a bendingmaterial including an organic material.
 16. The display device asclaimed in claim 15, wherein a height of the bending materialcorresponds to a sum of a first thickness of the at least one inorganiclayer and a second thickness of the intermediate wiring in a verticaldirection of the substrate.
 17. The display device as claimed in claim16, wherein a support material that supports the substrate is in aportion of the interval between the first substrate portion and thesecond substrate portion below the bending material.
 18. The displaydevice as claimed in claim 16, wherein the connection wiring extendsacross the first substrate portion, the bending area, and the secondsubstrate portion and is bendable in the bending area.
 19. The displaydevice as claimed in claim 18, wherein: the connection wiring isconnected to the first intermediate wiring portion and to the secondintermediate wiring portion respectively by contact portions insidecontact holes arranged in the at least one inorganic layer.
 20. Thedisplay device as claimed in claim 19, wherein: the connection wiring isexposed over the substrate, an upper organic layer covering theconnection wiring is on the connection wiring, and the connection wiringis surrounded by the bending material and the upper organic layer in thebending area.